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TURKEY'S FIRST ATOMIC LAYER DEPOSITION SYSTEM

A GLOBAL ALD SOLUTIONS PARTNER

OKYAY TECHNOLOGIES ALD SYSTEM

Atomic layer deposition (ALD) is a thin film deposition technique that is based on the sequential use of a gas phase chemical process. ALD is considered a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals, typically called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. Through the repeated exposure to separate precursors, a thin film is slowly deposited. ALD is a key process in the fabrication of semiconductor devices, and part of the set of tools available for the synthesis of nanomaterials.

 

-Efficient use of precursors and power-saving features

-Thin films with strong adhesion characteristics

-Pinhole/Particle-free films

-Reproducible results and excellent repeatability

-Many different substrates can be used for deposition;

-Deposited materials include (but not limited to)

 

*Oxides: Al2O3, HfO2, SiO2, TiO2, Ta2O5, ZrO2, V2O5, ZnO, ZnO:Al, WO3, NiO, MgO, RuO2

*Nitrides: TiN, TaN, Si3N4, AlN, GaN, InN, BN, WN, HfN

*Metals: Pt, Ru, Pd, Ni, W, Au

*Sulfides: ZnS

 

 

GALLERIES

OKYAY TECH ALD SYSTEM

OKYAY TECH T4
OKYAY TECH T8